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more high Tier circuit recipe changes

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Dream-Master 2017-04-30 23:34:06 +02:00
parent c84c31709a
commit 618674ae6c
1 changed files with 15 additions and 14 deletions
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src/main/java/gregtech/loaders/postload/GT_MachineRecipeLoader.java
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@ -498,7 +498,8 @@ public class GT_MachineRecipeLoader implements Runnable {
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Tin, 8), GT_OreDictUnificator.get(OrePrefixes.dustTiny, Materials.GalliumArsenide, 1), Materials.Glass.getMolten(288), ItemList.Circuit_Parts_Diode.get(8, o), 600, 30);
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Tin, 4), ItemList.Circuit_Silicon_Wafer.get(1, o), Materials.Glass.getMolten(288), ItemList.Circuit_Parts_Diode.get(4, o), 600, 30);
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Platinum, 4), GT_OreDictUnificator.get(OrePrefixes.dustSmall, Materials.Gallium, 1), Materials.Glass.getMolten(288), ItemList.Circuit_Parts_DiodeSMD.get(32, o), 400, 192);
GT_ModHandler.addCraftingRecipe(ItemList.Circuit_Parts_Coil.get(1, o), new Object[]{"WWW", "WDW", "WWW", 'G', new ItemStack(Blocks.glass_pane), 'D', ItemList.IC2_Item_Casing_Steel.get(1, o), 'W', OrePrefixes.wireFine.get(Materials.Copper)});
//GT_ModHandler.addCraftingRecipe(ItemList.Circuit_Parts_Coil.get(1, o), new Object[]{"WWW", "WDW", "WWW", 'G', new ItemStack(Blocks.glass_pane), 'D', ItemList.IC2_Item_Casing_Steel.get(1, o), 'W', OrePrefixes.wireFine.get(Materials.Copper)});
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.stick, Materials.IronMagnetic, 1), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Copper, 32), Materials.Plastic.getFluid(144), ItemList.Circuit_Parts_Coil.get(4, o), 320, 30);
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.plate, Materials.Silicon, 1), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Tin, 8), Materials.Plastic.getMolten(144), ItemList.Circuit_Parts_Transistor.get(8, o), 160, 30);
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.plate, Materials.Gallium, 1), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.AnnealedCopper, 8), Materials.Plastic.getMolten(288), ItemList.Circuit_Parts_TransistorSMD.get(16, o), 160, 120);
GT_Values.RA.addAssemblerRecipe(GT_OreDictUnificator.get(OrePrefixes.foil, Materials.Plastic, 2), GT_OreDictUnificator.get(OrePrefixes.foil, Materials.Aluminium, 2), Materials.Plastic.getMolten(144), ItemList.Circuit_Parts_Capacitor.get(2, o), 160, 120);
@ -513,12 +514,12 @@ public class GT_MachineRecipeLoader implements Runnable {
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_NAND.get(1, o), ItemList.Circuit_Chip_NAND.get(32, o), null, 600, 192);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_NOR.get(1, o), ItemList.Circuit_Chip_NOR.get(16, o), null, 600, 192);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_CPU.get(1, o), ItemList.Circuit_Chip_CPU.get(8, o), null, 600, 120);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_SoC.get(1, o), ItemList.Circuit_Chip_SoC.get(6, o), null, 600, 120);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_SoC2.get(1, o), ItemList.Circuit_Chip_SoC2.get(6, o), null, 600, 120);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_PIC.get(1, o), ItemList.Circuit_Chip_PIC.get(4, o), null, 600, 48);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_HPIC.get(1, o), ItemList.Circuit_Chip_HPIC.get(2, o), null, 600, 48);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_NanoCPU.get(1, o), ItemList.Circuit_Chip_NanoCPU.get(7, o), null, 600, 48);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_QuantumCPU.get(1, o), ItemList.Circuit_Chip_QuantumCPU.get(5, o), null, 600, 48);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_SoC.get(1, o), ItemList.Circuit_Chip_SoC.get(6, o), null, 600, 480);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_SoC2.get(1, o), ItemList.Circuit_Chip_SoC2.get(6, o), null, 600, 1024);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_PIC.get(1, o), ItemList.Circuit_Chip_PIC.get(4, o), null, 600, 1024);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_HPIC.get(1, o), ItemList.Circuit_Chip_HPIC.get(2, o), null, 600, 4096);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_NanoCPU.get(1, o), ItemList.Circuit_Chip_NanoCPU.get(7, o), null, 600, 480);
GT_Values.RA.addCutterRecipe(ItemList.Circuit_Wafer_QuantumCPU.get(1, o), ItemList.Circuit_Chip_QuantumCPU.get(5, o), null, 600, 1920);
GT_Values.RA.addChemicalRecipe(ItemList.Circuit_Wafer_PIC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.dust, Materials.IndiumGalliumPhosphide, 2), Materials.RedstoneAlloy.getMolten(288), null, ItemList.Circuit_Wafer_HPIC.get(1, o), 1200, 1920);
GT_Values.RA.addChemicalRecipe(ItemList.Circuit_Wafer_CPU.get(1, o), GT_Utility.copyAmount(16, ic2.core.Ic2Items.carbonFiber), Materials.Glowstone.getMolten(576), null, ItemList.Circuit_Wafer_NanoCPU.get(1, o), 400, 1920);
GT_Values.RA.addChemicalRecipe(ItemList.Circuit_Wafer_NanoCPU.get(1, o), GT_OreDictUnificator.get(OrePrefixes.dust, Materials.IndiumGalliumPhosphide, 1), Materials.Radon.getGas(50), null, ItemList.Circuit_Wafer_QuantumCPU.get(1, o), 600, 1920);
@ -572,12 +573,12 @@ public class GT_MachineRecipeLoader implements Runnable {
//Highly Integrated Circuits
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_CPU.get(1, o), ItemList.Circuit_Parts_Resistor.get(4, o), ItemList.Circuit_Parts_Capacitor.get(4, o), ItemList.Circuit_Parts_Transistor.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Processor.get(1, o), 200, 60, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Processor.get(3, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_Capacitor.get(4, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 12)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Computer.get(1, o), 400, 90);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Processor.get(2, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_Capacitor.get(8, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 12)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Computer.get(1, o), 400, 120);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_CPU.get(1, o), ItemList.Circuit_Chip_NAND.get(32, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 8), GT_OreDictUnificator.get(OrePrefixes.plate, Materials.Plastic, 4)}, tMat.getMolten(144L * tMultiplier), ItemList.Tool_DataStick.get(1, o), 400, 90);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(2, o), ItemList.Circuit_Advanced.get(2, o), ItemList.Circuit_Parts_Diode.get(4, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 6)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Data.get(1, o), 400, 90);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{GT_OreDictUnificator.get(OrePrefixes.frameGt, Materials.Aluminium, 1), ItemList.Circuit_Data.get(4, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_Capacitor.get(24, o), ItemList.Circuit_Chip_Ram.get(16, o), GT_OreDictUnificator.get(OrePrefixes.wireGt01, Materials.AnnealedCopper, 12)}, tMat.getMolten(144L * tMultiplier * 2), ItemList.Circuit_Elite.get(1, o), 1600, 480);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_CPU.get(1, o), ItemList.Circuit_Parts_ResistorSMD.get(4, o), ItemList.Circuit_Parts_CapacitorSMD.get(4, o), ItemList.Circuit_Parts_TransistorSMD.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Processor.get(1, o), 200, 60, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Processor.get(3, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_CapacitorSMD.get(4, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 12)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Computer.get(1, o), 400, 80);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Processor.get(2, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_CapacitorSMD.get(8, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 12)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Computer.get(1, o), 400, 96);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(2, o), ItemList.Circuit_Advanced.get(2, o), ItemList.Circuit_Parts_DiodeSMD.get(4, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 6)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Data.get(1, o), 400, 90);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{GT_OreDictUnificator.get(OrePrefixes.frameGt, Materials.Aluminium, 1), ItemList.Circuit_Data.get(4, o), ItemList.Circuit_Parts_Coil.get(4, o), ItemList.Circuit_Parts_CapacitorSMD.get(24, o), ItemList.Circuit_Chip_Ram.get(16, o), GT_OreDictUnificator.get(OrePrefixes.wireGt01, Materials.AnnealedCopper, 12)}, tMat.getMolten(144L * tMultiplier * 2), ItemList.Circuit_Elite.get(1, o), 1600, 480);
//Nanotech Circuits
@ -601,11 +602,11 @@ public class GT_MachineRecipeLoader implements Runnable {
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Wetware.get(2, o), ItemList.Circuit_Wetwarecomputer.get(2, o), ItemList.Circuit_Parts_DiodeSMD.get(4, o), ItemList.Circuit_Chip_NOR.get(4, o), ItemList.Circuit_Chip_Ram.get(4, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.YttriumBariumCuprate, 6)}, tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Wetwaresupercomputer.get(1, o), 400, 38400);
//SoC
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_SoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Basic.get(1, o), 50, 600);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_SoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Processor.get(1, o), 50, 2400, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Fiberglass.get(1, o), ItemList.Circuit_Chip_SoC2.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Platinum, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Nanoprocessor.get(1, o), 50, 9600);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Fiberglass.get(1, o), ItemList.Circuit_Chip_SoC2.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.NiobiumTitanium, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Quantumprocessor.get(1, o), 50, 38400);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Multifiberglass.get(1, o), ItemList.Circuit_Chip_CrystalSoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.YttriumBariumCuprate, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Crystalprocessor.get(1, o), 50, 153600);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_SoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 8), GT_OreDictUnificator.get(OrePrefixes.stickLong, Materials.AnnealedCopper, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Basic.get(1, o), 50, 600, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy_Advanced.get(1, o), ItemList.Circuit_Chip_SoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16), GT_OreDictUnificator.get(OrePrefixes.stickLong, Materials.Platinum, 16)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Processor.get(1, o), 50, 2400, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Fiberglass.get(1, o), ItemList.Circuit_Chip_SoC2.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Platinum, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Nanoprocessor.get(1, o), 50, 9600, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Fiberglass.get(1, o), ItemList.Circuit_Chip_SoC2.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.NiobiumTitanium, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Quantumprocessor.get(1, o), 50, 38400, true);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Multifiberglass.get(1, o), ItemList.Circuit_Chip_CrystalSoC.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.YttriumBariumCuprate, 8)}, tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Crystalprocessor.get(1, o), 50, 153600, true);
//Lapoorbs
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Multifiberglass.get(1, o), ItemList.Circuit_Chip_PIC.get(4, o), ItemList.Circuit_Parts_Crystal_Chip_Master.get(18L, o), ItemList.Circuit_Chip_NanoCPU.get(1, o), GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Platinum, 16)}, tMat.getMolten(144L * tMultiplier), ItemList.Energy_LapotronicOrb.get(1, o), 512, 1024);