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Merge pull request #952 from Techlone/soldering_alloy

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Config for using only soldering alloy
This commit is contained in:
Blood-Asp 2017-03-16 14:56:45 +01:00 committed by GitHub
commit f4dae834da
4 changed files with 12 additions and 8 deletions
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2
src/main/java/gregtech/GT_Mod.java
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@ -263,6 +263,8 @@ public class GT_Mod implements IGT_Mod {
GregTech_API.mRFExplosions = GregTech_API.sOPStuff.get(ConfigCategories.general, "RFExplosions", false);
GregTech_API.meIOLoaded = Loader.isModLoaded("EnderIO");
GregTech_API.mUseOnlyGoodSolderingMaterials = GregTech_API.sRecipeFile.get(ConfigCategories.Recipes.harderrecipes, "useonlygoodsolderingmaterials", GregTech_API.mUseOnlyGoodSolderingMaterials);
if (tMainConfig.get("general", "hardermobspawners", true).getBoolean(true)) {
Blocks.mob_spawner.setHardness(500.0F).setResistance(6000000.0F);
}

3
src/main/java/gregtech/api/GregTech_API.java
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@ -197,6 +197,9 @@ public class GregTech_API {
public static boolean mMagneticraft = false;
public static boolean mImmersiveEngineering = false;
public static boolean mGTPlusPlus = false;
public static boolean mUseOnlyGoodSolderingMaterials = false;
private static final String aTextIC2Lower = MOD_ID_IC2.toLowerCase(Locale.ENGLISH);
/**
* Getting assigned by the Mod loading

8
src/main/java/gregtech/loaders/oreprocessing/ProcessingCircuit.java
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@ -34,13 +34,7 @@ public class ProcessingCircuit implements gregtech.api.interfaces.IOreRecipeRegi
GT_ModHandler.addShapelessCraftingRecipe(ItemList.Circuit_Basic.get(1L, new Object[0]), new Object[]{ItemList.Circuit_Integrated.getWildcard(1L, new Object[0])});
break;
case "Advanced":
GT_ModHandler.removeRecipeByOutput(aStack);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_Transistor.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.SolderingAlloy.getMolten(72), aStack, 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_TransistorSMD.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.SolderingAlloy.getMolten(72), aStack, 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_Transistor.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.Tin.getMolten(144), aStack, 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_TransistorSMD.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.Tin.getMolten(144), aStack, 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_Transistor.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.Lead.getMolten(288), aStack, 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_TransistorSMD.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},Materials.Lead.getMolten(288), aStack, 800, 28);
GT_ModHandler.removeRecipeByOutput(aStack);
break;
}
}

7
src/main/java/gregtech/loaders/postload/GT_MachineRecipeLoader.java
View file

@ -492,7 +492,7 @@ if(Loader.isModLoaded("Railcraft")){
GT_Values.RA.addFormingPressRecipe(ItemList.Food_Dough_Sugar.get(4L, new Object[0]), ItemList.Shape_Mold_Cylinder.get(0L, new Object[0]), ItemList.Food_Raw_Cake.get(1L, new Object[0]), 384, 4);
GT_Values.RA.addFormingPressRecipe(new ItemStack(Blocks.glass, 1, 32767), ItemList.Shape_Mold_Arrow.get(0L, new Object[0]), ItemList.Arrow_Head_Glass_Emtpy.get(1L, new Object[0]), 64, 4);
for (Materials tMat : Materials.values()) {
if ((tMat.mStandardMoltenFluid != null) && (tMat.contains(SubTag.SOLDERING_MATERIAL))) {
if (tMat.mStandardMoltenFluid != null && tMat.contains(SubTag.SOLDERING_MATERIAL) && !(GregTech_API.mUseOnlyGoodSolderingMaterials && !tMat.contains(SubTag.SOLDERING_MATERIAL_GOOD))) {
int tMultiplier = tMat.contains(SubTag.SOLDERING_MATERIAL_GOOD) ? 1 : tMat.contains(SubTag.SOLDERING_MATERIAL_BAD) ? 4 : 2;
//Circuit soldering
//Integraded Circuits
@ -500,6 +500,11 @@ if(Loader.isModLoaded("Railcraft")){
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Phenolic.get(1,o),ItemList.Circuit_Chip_ILC.get(1,o),ItemList.Circuit_Parts_ResistorSMD.get(2,o),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Copper, 4)},tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Basic.get(1,o), 200, 8);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Phenolic.get(1,o),ItemList.Circuit_Chip_ILC.get(3,o),ItemList.Circuit_Parts_Resistor.get(4,o),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Gold, 8)},tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Integrated_Good.get(1,o), 400, 16);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Phenolic.get(1,o),ItemList.Circuit_Chip_ILC.get(3,o),ItemList.Circuit_Parts_ResistorSMD.get(4,o),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Gold, 8)},tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Integrated_Good.get(1,o), 400, 16);
//Advanced circuit
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_Transistor.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},tMat.getMolten(144L * tMultiplier / 2L), GT_ModHandler.getIC2Item("advancedCircuit", 1L), 800, 28);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Integrated_Good.get(2,new Object[0]),ItemList.Circuit_Chip_ILC.get(3,new Object[0]),ItemList.Circuit_Chip_Ram.get(1,new Object[0]),ItemList.Circuit_Parts_TransistorSMD.get(4,new Object[0]),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.Electrum, 16)},tMat.getMolten(144L * tMultiplier / 2L), GT_ModHandler.getIC2Item("advancedCircuit", 1L), 800, 28);
//Highly Integrated Circuits
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy.get(1,o),ItemList.Circuit_Chip_CPU.get(1,o),ItemList.Circuit_Parts_Resistor.get(4,o),ItemList.Circuit_Parts_Capacitor.get(4,o),ItemList.Circuit_Parts_Transistor.get(4,o),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 4)},tMat.getMolten(144L * tMultiplier / 2L), ItemList.Circuit_Processor.get(1,o), 200, 60);
GT_Values.RA.addCircuitAssemblerRecipe(new ItemStack[]{ItemList.Circuit_Board_Epoxy.get(1,o),ItemList.Circuit_Processor.get(3,o),ItemList.Circuit_Parts_Coil.get(4,o),ItemList.Circuit_Parts_Capacitor.get(4,o),ItemList.Circuit_Chip_Ram.get(4,o),GT_OreDictUnificator.get(OrePrefixes.wireFine, Materials.RedAlloy, 12)},tMat.getMolten(144L * tMultiplier), ItemList.Circuit_Computer.get(1,o), 400, 90);